1. Reflow soldering processes :SMT, BGA, CSP and flip chip technologies. ]CD[
Author: Lee, Ning-Cheng., Ning-Cheng Lee
Library: Library and Documentation Center of Kurdistan University (Kurdistan)
Subject: Design and construction ، Electronic apparatus and appliances,، Solder and soldering,، Electronic packaging,، Electric connectors
Classification :
TK7836
.
L43
2002
